Probe card device and neck-like probe thereof

ABSTRACT

A probe card device and a neck-like probe thereof are provided. The neck-like probe includes a conductive pin and a ring-shaped insulator. The conductive pin includes a stroke segment and two end segments extending from the stroke segment. The stroke segment has two broad side surfaces and two narrow side surfaces, and each of the broad side surfaces has a long slot extending from one of the narrow side surfaces to the other one. The two long slots have a minimum distance therebetween that is 75%-95% of a maximum distance between the two broad side surfaces. The ring-shaped insulator surrounds a portion of the conductive pin having the two long slots, and a portion of the neck-like probe corresponding in position to a part of the ring-shaped insulator on the two broad side surfaces has a thickness that is 85%-115% of the maximum distance.

CROSS-REFERENCE TO RELATED PATENT APPLICATION

This application claims the benefit of priority to Taiwan PatentApplication No. 109102060, filed on Jan. 21, 2020. The entire content ofthe above identified application is incorporated herein by reference.

Some references, which may include patents, patent applications andvarious publications, may be cited and discussed in the description ofthis disclosure. The citation and/or discussion of such references isprovided merely to clarify the description of the present disclosure andis not an admission that any such reference is “prior art” to thedisclosure described herein. All references cited and discussed in thisspecification are incorporated herein by reference in their entiretiesand to the same extent as if each reference was individuallyincorporated by reference.

FIELD OF THE DISCLOSURE

The present disclosure relates to a probe card, and more particularly toa probe card device and a neck-like probe thereof.

BACKGROUND OF THE DISCLOSURE

A conventional conductive probe includes a conductive pin and aninsulating layer that is formed on a central portion of the conductivepin. Any portions of the conductive pin have the same width and the samethickness, so that the insulating layer is formed as a protrusion.However, the cooperative configuration between the conductive pin andthe insulating layer of the conventional conductive probe has been inuse for many years, so that further development and progress of probecard devices are impeded.

SUMMARY OF THE DISCLOSURE

In response to the above-referenced technical inadequacies, the presentdisclosure provides a probe card device and a neck-like probe thereof toeffectively improve on the issues associated with conventionalconductive probes.

In one aspect, the present disclosure provides a probe card device,which includes a first guide unit, a second guide unit spaced apart fromthe first guide unit, and a plurality of neck-like probes. Each of theneck-like probes is in an elongated shape defining a longitudinaldirection. Each of the neck-like probes has a probe length along thelongitudinal direction thereof, and passes through and is held by thefirst guide unit and the second guide unit. Each of the neck-like probesincludes a conductive pin and a ring-shaped insulator. The conductivepin includes a stroke segment and two end segments. The stroke segmentis arranged between the first guide unit and the second guide unit, andhas two broad side surfaces and two narrow side surfaces. Each of thetwo broad side surfaces of the stroke segment has a long slot extendingfrom one of the two narrow side surfaces to the other one of the twonarrow side surfaces. The two long slots are arranged adjacent to eachother and have a minimum distance therebetween that is 75%-95% of amaximum distance between the two broad side surfaces. The two endsegments respectively extend from two ends of the stroke segment toprotrude from the first guide unit and the second guide unit. Thering-shaped insulator is arranged in the two long slots of theconductive pin and is formed on a portion of each of the two narrow sidesurfaces between the two long slots. A portion of the neck-like probecorresponding in position to a part of the ring-shaped insulator on thetwo broad side surfaces has a thickness that is 85%-115% of the maximumdistance. When the first guide unit and the second guide unit arestaggered in an oblique direction by a displacement distance that is12%-19% of the probe length, the stroke segments of the neck-like probesare bent toward the same direction, and the two broad side surfaces ofeach of the stroke segments respectively have two inflection points thatare respectively located in the two long slots thereof.

In another aspect, the present disclosure provides a neck-like probe ofa probe card device, which includes a conductive pin and a ring-shapedinsulator. The conductive pin includes a stroke segment and two endsegments that respectively extend from two ends of the stroke segment.The stroke segment has two broad side surfaces and two narrow sidesurfaces. Each of the two broad side surfaces of the stroke segment hasa long slot extending from one of the two narrow side surfaces to theother one of the two narrow side surfaces. The two long slots arearranged adjacent to each other and have a minimum distance therebetweenthat is 75%-95% of a maximum distance between the two broad sidesurfaces. The ring-shaped insulator surrounds a portion of strokesegment having the two long slots. A portion of the neck-like probecorresponding in position to a part of the ring-shaped insulator on thetwo broad side surfaces has a thickness that is 85%-115% of the maximumdistance. When the two end segments of the neck-like probe are forced tobend the stroke segment, the two broad side surfaces respectively havetwo inflection points that are respectively located in the two longslots thereof.

Therefore, by virtue of “the probe card device” and “the neck-likeprobe” of the present disclosure, the conductive pin is formed with thetwo long slots to effectively control an abutting force thereof, so thatwhen the conductive pin is used to abut against a device under test(DUT), the abutting force of the conductive pin can be maintained undera predetermined condition, and the conductive pin can be firmly abuttedagainst and avoid destroying the DUT.

Moreover, the minimum distance of the conductive pin can be adjusted tochange a reaction force generated from the neck-like probe when theneck-like probe is forced, thereby satisfying different requirements.Moreover, a ratio of the minimum distance to the maximum distance can becontrolled to effectively maintain the signal transmission performanceof the neck-like probe.

In addition, a portion of the ring-shaped insulator protruding from thebroad side surfaces can be reduced by providing that the neck-like probebe formed with the two long slots, thereby protecting the ring-shapedinsulator (e.g., when the neck-like probe is assembled to pass throughthe first guide unit, the ring-shaped insulator can effectively avoidbeing scratched by the first guide unit).

The curved portion of the neck-like probe can be controlled to belocated at the two long slots by forming the two long slots (e.g., theinflection point is located in the long slot), so that the neck-likeprobes can be effectively controlled to bend along the same direction,and each of the neck-like probes is independently operated (e.g., isindependently abutted against the DUT) and do not interfere with eachother.

These and other aspects of the present disclosure will become apparentfrom the following description of the embodiment taken in conjunctionwith the following drawings and their captions, although variations andmodifications therein may be affected without departing from the spiritand scope of the novel concepts of the disclosure.

BRIEF DESCRIPTION OF THE DRAWINGS

The present disclosure will become more fully understood from thefollowing detailed description and accompanying drawings.

FIG. 1 is a cross-sectional view of a probe card device according to afirst embodiment of the present disclosure.

FIG. 2 is a perspective view of a neck-like probe according to the firstembodiment of the present disclosure.

FIG. 3 is a perspective view showing a conductive pin of FIG. 2.

FIG. 4 is a cross-sectional view taken along line IV-IV of FIG. 2.

FIG. 5 is a cross-sectional view showing another configuration of FIG.4.

FIG. 6 is a cross-sectional view showing yet another configuration ofFIG. 4.

FIG. 7 is a cross-sectional view showing another configuration of theprobe card device according to the first embodiment of the presentdisclosure.

FIG. 8 is a top view showing the probe card device of FIG. 1 when afirst guide unit and a second guide unit are in a staggered arrangement.

FIG. 9 is a cross-sectional view showing the probe card device of FIG. 1when the first guide unit and the second guide unit are in the staggeredarrangement.

FIG. 10 is a perspective view of a neck-like probe according to a secondembodiment of the present disclosure.

FIG. 11 is a perspective view showing a conductive pin of FIG. 10.

DETAILED DESCRIPTION OF THE EXEMPLARY EMBODIMENTS

The present disclosure is more particularly described in the followingexamples that are intended as illustrative only since numerousmodifications and variations therein will be apparent to those skilledin the art. Like numbers in the drawings indicate like componentsthroughout the views. As used in the description herein and throughoutthe claims that follow, unless the context clearly dictates otherwise,the meaning of “a”, “an”, and “the” includes plural reference, and themeaning of “in” includes “in” and “on”. Titles or subtitles can be usedherein for the convenience of a reader, which shall have no influence onthe scope of the present disclosure.

The terms used herein generally have their ordinary meanings in the art.In the case of conflict, the present document, including any definitionsgiven herein, will prevail. The same thing can be expressed in more thanone way. Alternative language and synonyms can be used for any term(s)discussed herein, and no special significance is to be placed uponwhether a term is elaborated or discussed herein. A recital of one ormore synonyms does not exclude the use of other synonyms. The use ofexamples anywhere in this specification including examples of any termsis illustrative only, and in no way limits the scope and meaning of thepresent disclosure or of any exemplified term. Likewise, the presentdisclosure is not limited to various embodiments given herein. Numberingterms such as “first”, “second” or “third” can be used to describevarious components, signals or the like, which are for distinguishingone component/signal from another one only, and are not intended to, norshould be construed to impose any substantive limitations on thecomponents, signals or the like.

First Embodiment

Referring to FIG. 1 to FIG. 9, a first embodiment of the presentdisclosure provides a probe card device 100. As shown in FIG. 1 to FIG.3, two opposite sides of the probe card device 100 are configured toabut against a space transformer and a device under test (DUT) (e.g., asemiconductor wafer), respectively. The probe card device 100 includes afirst guide unit 1, a second guide unit 2 spaced apart from the firstguide unit 1, a spacer (not shown) sandwiched between the first guideunit 1 and the second guide unit 2, and a plurality of neck-like probes3 that pass through and are held by the first guide unit 1 and thesecond guide unit 2.

It should be noted that the neck-like probes 3 in the present embodimentare described in cooperation with the first guide unit 1, the secondguide unit 2, and the spacer, but the present disclosure is not limitedthereto. For example, in other embodiments of the present disclosure,the neck-like probe 3 can be independently used (e.g., sold) or can beused in cooperation with other components.

In the present embodiment, the first guide unit 1 includes a pluralityof first guide boards 11 (and at least one spacing sheet sandwichedbetween any two of the first guide boards 11 adjacent to each other).The second guide unit 2 includes a plurality of second guide boards 21(and at least one spacing sheet sandwiched between any two of the secondguide boards 21 adjacent to each other). The first guide boards 11 canbe in a staggered arrangement, the second guide boards 21 can be in astaggered arrangement, and the first guide unit 1 and the second guideunit 2 can be in a staggered arrangement. However, in other embodimentsof the present disclosure, the first guide unit 1 can include only onefirst guide board 11, and the second guide unit 2 can include only onesecond guide board 21.

Moreover, the spacer can be a ring-shaped structure sandwiched betweenperipheral portions of the first guide unit 1 and the second guide unit2, but the present disclosure is not limited thereto. For example, inother embodiments of the present disclosure, the spacer of the probecard device 100 can be omitted or can be replaced by other components.

As the neck-like probes 3 in the present embodiment are of the samestructure, the following description discloses the structure of just oneof the neck-like probes 3 for the sake of brevity, but the presentdisclosure is not limited thereto. For example, in other embodiments ofthe present disclosure, the neck-like probes 3 can be of differentstructure.

Moreover, in the following description, the first guide boards 11 andthe second guide boards 21 are each in the staggered arrangement, butthe first unit 1 and the second unit 2 are not in the staggeredarrangement for clearly describing the structure of the neck-like probe3.

As shown in FIG. 1 to FIG. 4, the neck-like probe 3 is in an elongatedshape defining a longitudinal direction L, and has a probe length L3along the longitudinal direction L. Any cross section of the neck-likeprobe 3 perpendicular to the longitudinal direction L in the presentembodiment is in the shape of a rectangle, but the present disclosure isnot limited thereto. The neck-like probe 3 includes a conductive pin 31and a ring-shaped insulator 32 that surrounds a substantially centerportion of the conductive pin 31. In other words, any non-insulatedmember surrounding the conductive pin is different from the ring-shapedinsulator 32 of the present embodiment.

The conductive pin 31 can be made of a copper alloy or a nickel alloy,and the conductive pin 31 in the present embodiment is integrally formedas a one piece structure and is in a straight shape, but the presentdisclosure is not limited thereto. The conductive pin 31 has a strokesegment 311 and two end segments 312 that integrally extend from twoends of the stroke segment 311, respectively. The stroke segment 311 isarranged between the first guide unit 1 and the second guide unit 2, andthe two end segments 312 respectively protrude from the first guide unit1 and the second guide unit 2.

An outer surface of the stroke segment 311 has two broad side surfaces311 a respectively arranged on two opposite sides thereof and two narrowside surfaces 311 b respectively arranged on two opposite sides thereof.Each of the two broad side surfaces 311 a of the stroke segment 311 hasa long slot 311 c extending from one of the two narrow side surfaces 311b to the other one of the two narrow side surfaces 311 b. Moreover, thestroke segment 311 in the present embodiment does not have anyprotrusion formed on the two broad side surfaces 311 a and the twonarrow side surfaces 311 b. In other words, any stroke segment having aprotrusion for abutting against the first guide unit 1 or the secondguide unit 2 is different from the stroke segment 311 of the presentembodiment.

Accordingly, the conductive pin 31 is formed with the two long slots 311c to effectively control an abutting force thereof, so that when theconductive pin 31 is used to abut against the DUT, the abutting force ofthe conductive pin 31 can be maintained under a predetermined condition,and the conductive pin 31 can be firmly abutted against while avoidingdamage to the DUT.

Each of the two long slots 311 c extends from one of the two narrow sidesurfaces 311 b to the other one of the two narrow side surfaces 311 balong a direction (e.g., a horizontal direction shown in FIG. 2) that isperpendicular to the longitudinal direction L. In other words, anextending distance or a width of each of the two long slots 311 c issubstantially equal to a distance between the two narrow side surfaces311 b. Moreover, a length L311 c of any one of the two long slots 311 calong the longitudinal direction L is at least 50% of a length L311 ofthe stroke segment 311 along the longitudinal direction L. For example,as shown in FIG. 1, the length L311 c of the long slot 311 c is 45%-60%of the length L311 of the stroke segment 311. Or, as shown in FIG. 7,the length L311 c of the long slot 311 c can be 80%-95% of the lengthL311 of the stroke segment 311.

Specifically, the two long slots 311 c are arranged adjacent to eachother and have a minimum distance Dmin therebetween (e.g., a distancebetween bottoms of the two long slots 311 c) that is 75%-95% of amaximum distance Dmax between the two broad side surfaces 311 a.Accordingly, the minimum distance Dmin of the conductive pin 31 can beadjusted to change a reaction force generated from the neck-like probe 3when the neck-like probe 3 is acted upon by a force, thereby satisfyingdifferent requirements. Moreover, a ratio of the minimum distance Dminto the maximum distance Dmax can be controlled to effectively maintainthe signal transmission performance of the neck-like probe 3.

Moreover, a distance between the two long slots 311 c as shown in FIG. 4of the present embodiment gradually decreases and then graduallyincreases along the longitudinal direction L, but the present disclosureis not limited thereto. For example, as shown in FIG. 6, the distancebetween the two long slots 311 c can have the same value. Or, in otherembodiments of the present disclosure, the structures of the two longslots 311 c can be changed or adjusted according to design requirements.

As shown in FIG. 3, the two long slots 311 c of the stroke segment 311in the present embodiment are in a mirror-symmetrical arrangement, butthe present disclosure is not limited thereto. For example, in otherembodiments of the present disclosure, the two long slots 311 c can havedifferent depths or different lengths; or the two long slots 311 c canbe of different structure.

An outer surface of each of the end segments 312 has two broad sidesurfaces and two narrow side surfaces, and the two broad side surfacesand two narrow side surfaces of each of the end segments 312 in thepresent embodiment are respectively coplanar with the two broad sidesurfaces 311 a and the two narrow side surfaces 311 b of the strokesegment 311. In other words, each of the two end segments 312 in thepresent embodiment does not have any protrusion formed on the outersurface thereof, and the two end segments 312 are of the samerectangular column, but the present disclosure is not limited thereto.For example, any one of the two end segments 312 can have a protrusionaccording to design requirements.

Moreover, a portion of one of the two end segments 312 (e.g., the upperend segment 312 shown in FIG. 1) is arranged in thru-holes (not shown)of the first guide boards 11, and the other portion of the one of thetwo end segments 312 protrudes from the first guide boards 11, so thatthe one of the two end segments 312 can be fixed by staggeredlyarranging the first guide boards 11. A portion of the other one of thetwo end segments 312 (e.g., the lower end segment 312 shown in FIG. 1)is arranged in thru-holes (not shown) of the second guide boards 21, andthe other portion of the other one of the two end segments 312 protrudesfrom the second guide boards 21, so that the other one of the two endsegments 312 can be fixed by staggeredly arranging the second guideboards 21.

The ring-shaped insulator 32 can be made of parylene, and any portionsof the ring-shaped insulator 32 have the same thickness. The ring-shapedinsulator 32 surrounds a portion of the conductive pin 31 having the twolong slots 311 c. In the present embodiment, the ring-shaped insulator32 is arranged in the two long slots 311 c of the conductive pin 311 andis formed on a portion of each of the two narrow side surfaces 311 bbetween the two long slots 311 c, but the present disclosure is notlimited thereto.

Accordingly, a portion of the ring-shaped insulator 32 protruding fromthe broad side surfaces 311 a can be reduced by providing the neck-likeprobe 3 to be formed with the two long slots 311 c, thereby protectingthe ring-shaped insulator 32 (e.g., when the neck-like probe 3 isassembled to pass through the first guide unit 1, the ring-shapedinsulator 32 can effectively avoid being scratched by the first guideunit 1). In other words, the two long slots 311 c of the conductive pin31 can be filled with the ring-shaped insulator 32, so that theneck-like probe 3 can be formed in a substantial straight shape.

A portion of the neck-like probe 3 corresponding in position to a partof the ring-shaped insulator 32 on the two broad side surfaces 311 a hasa thickness T that is 85%-115% of the maximum distance Dmax. Moreover,the thickness T is preferably 90%-110% of the maximum distance Dmax. Inother words, a part of the ring-shaped insulator 32 can slightlyprotrude from the two long slots 311 c or can be arranged in the twolong slots 311 c, but the present disclosure is not limited thereto.

Specifically, the part of the ring-shaped insulator 32 on any one of thetwo broad side surfaces 311 a has a filled portion 321 arranged in thecorresponding long slot 311 c and two end portions 322 that arerespectively connected to two opposite sides of the filled portion 321and that protrude from the corresponding long slot 311 c (or a portionof the broad side surface 311 a adjacent to the corresponding long slot311 c), and the two end portions 322 are configured to be boundariesdefining the thickness T. Moreover, another part of the ring-shapedinsulator 32 disposed on the two narrow side surfaces 311 b has the formof a protrusion with respect to the conductive pin 31.

The above description of the ring-shaped insulator 32 is based on FIG. 4of the present embodiment, but the present disclosure is not limitedthereto. For example, as shown in FIG. 5, the two end portions 322 ofthe ring-shaped insulator 32 can further extend to the broad sidesurface 311 a outside of any one of the long slots 311 c. Or, as shownin FIG. 6, the ring-shaped insulator 32 does not protrude from the twolong slots 311 c and can be coplanar with any one of the broad sidesurfaces 311 a outside of the corresponding long slot 311 c.

In the above description, the structure of the neck-like probe 3 isdescribed under the premise that the first guide unit 1 and the secondguide unit 2 are not in the staggered arrangement, and in the followingdescription, the neck-like probes 3 are described under the premise thatthe first guide unit 1 and the second guide unit 2 are in the staggeredarrangement.

Specifically, as shown in FIG. 8 and FIG. 9, when the first guide unit 1and the second guide unit 2 are staggered in an oblique direction by adisplacement distance D1 that is 12%-19% of the probe length L3 (shownin FIG. 1), the stroke segments 311 of the neck-like probes 3 are benttoward the same direction, and the two broad side surfaces 311 a of eachof the stroke segments 311 respectively have two inflection points Pthat are respectively located in the two long slots 311 c thereof.Specifically, two of the inflection points P (e.g., any two of theinflection points P located on the upper sides of the neck-like probes 3shown in FIG. 9) respectively belonging to any two of the neck-likeprobes 3 and facing the same side are each spaced apart from the firstguide unit 1 by a distance DP1, DP2, and the distances DP1, DP2 definedby the two of the inflection points P have a difference that is lessthan or equal to 1% of the probe length L3 (shown in FIG. 1).

Accordingly, by forming the two long slots 311 c, the curved portion ofthe neck-like probe 3 can be controlled to be located at the two longslots 311 c (e.g., the inflection point P is located in the long slot311 c), so that the neck-like probes 3 can be effectively controlled tobend along the same direction, and each of the neck-like probes 3 can beindependently operated (e.g., is independently abutted against the DUT)and they do not interfere with each other.

Second Embodiment

Referring to FIG. 10 and FIG. 11, a second embodiment of the presentdisclosure is similar to the first embodiment of the present disclosure.For the sake of brevity, descriptions of the same components in thefirst and second embodiments of the present disclosure will be omittedherein, and the following description only discloses different featuresbetween the first and second embodiments.

In the present embodiment, each of the two narrow side surfaces 311 b ofthe stroke segment 311 has a short slot 311 d having two opposite endsbeing respectively in spatial communication with the two long slots 311c. In other words, the two long slots 311 c and the two short slots 311d are jointly formed as a rectangular ring-shaped groove. Moreover, thetwo long slots 311 c are in a mirror-symmetrical arrangement, and thetwo short slots 311 d are in a mirror-symmetrical arrangement, but thepresent disclosure is not limited thereto. For example, in otherembodiments of the present disclosure, the two short slots 311 d canhave different depths or lengths; or, the two short slots 311 d can beof different structure.

Moreover, the ring-shaped insulator 32 is arranged in the two long slots311 c and the two short slots 311 d. In the present embodiment, thering-shaped insulator 32 does not protrude from any one of the two longslots 311 c and is coplanar with the two broad side surfaces 311 aoutside of the rectangular ring-shaped groove, but the presentdisclosure is not limited thereto. For example, in other embodiments ofthe present disclosure, the ring-shaped insulator 32 can have an endportion protruding from at least one of the two short slots 311 d; or,the ring-shaped insulator 32 can further have a portion extending fromthe end portion to the narrow side surface 311 b adjacent to the shortslot 311 d.

In conclusion, by virtue of “the probe card device” and “the neck-likeprobe” of the present disclosure, the conductive pin 31 is formed withthe two long slots 311 c to effectively control an abutting forcethereof, so that when the conductive pin 31 is used to abut against theDUT, the abutting force of the conductive pin 31 can be maintained undera predetermined condition, and the conductive pin 31 can be firmlyabutted against while avoiding damage to the DUT.

Moreover, the minimum distance Dmin of the conductive pin 31 can beadjusted to change a reaction force generated from the neck-like probe 3when the neck-like probe 3 is acted upon by a force, thereby satisfyingdifferent requirements. Moreover, a ratio of the minimum distance Dminto the maximum distance Dmax can be controlled to effectively maintainthe signal transmission performance of the neck-like probe 3.

In addition, a portion of the ring-shaped insulator 32 protruding fromthe broad side surfaces 311 a can be reduced by providing the neck-likeprobe 3 to be formed with the two long slots 311 c, thereby protectingthe ring-shaped insulator 32 (e.g., when the neck-like probe 3 isassembled to pass through the first guide unit 1, the ring-shapedinsulator 32 can effectively avoid being scratched by the first guideunit 1).

Moreover, by forming the two long slots 311 c, the curved portion of theneck-like probe 3 can be controlled to be located at the two long slots311 c (e.g., the inflection point P is located in the long slot 311 c),so that the neck-like probes 3 can be effectively controlled to bendalong the same direction, and each of the neck-like probes 3 can beindependently operated (e.g., is independently abutted against the DUT)and they do not interfere with each other.

The foregoing description of the exemplary embodiments of the disclosurehas been presented only for the purposes of illustration and descriptionand is not intended to be exhaustive or to limit the disclosure to theprecise forms disclosed. Many modifications and variations are possiblein light of the above teaching.

The embodiments were chosen and described in order to explain theprinciples of the disclosure and their practical application so as toenable others skilled in the art to utilize the disclosure and variousembodiments and with various modifications as are suited to theparticular use contemplated. Alternative embodiments will becomeapparent to those skilled in the art to which the present disclosurepertains without departing from its spirit and scope.

What is claimed is:
 1. A probe card device, comprising: a first guide unit and a second guide unit that is spaced apart from the first guide unit; and a plurality of neck-like probes each being in an elongated shape defining a longitudinal direction, wherein each of the neck-like probes has a probe length along the longitudinal direction thereof, and passes through and is held by the first guide unit and the second guide unit, and wherein each of the neck-like probes includes: a conductive pin including: a stroke segment arranged between the first guide unit and the second guide unit and having two broad side surfaces and two narrow side surfaces, wherein each of the two broad side surfaces of the stroke segment has a long slot extending from one of the two narrow side surfaces to the other one of the two narrow side surfaces, and wherein the two long slots are arranged adjacent to each other and have a minimum distance therebetween that is 75%-95% of a maximum distance between the two broad side surfaces; and two end segments respectively extending from two ends of the stroke segment to protrude from the first guide unit and the second guide unit; and a ring-shaped insulator arranged in the two long slots of the conductive pin and formed on a portion of each of the two narrow side surfaces between the two long slots, wherein a portion of the neck-like probe corresponding in position to a part of the ring-shaped insulator on the two broad side surfaces has a thickness that is 85%-115% of the maximum distance, wherein when the first guide unit and the second guide unit are staggered in an oblique direction by a displacement distance that is 12%-19% of the probe length, the stroke segments of the neck-like probes are bent toward the same direction, and the two broad side surfaces of each of the stroke segments respectively have two inflection points that are respectively located in the two long slots thereof.
 2. The probe card device according to claim 1, wherein in each of the neck-like probes, the two long slots of the stroke segment are in a mirror-symmetrical arrangement, and each of the two long slots extends from one of the two narrow side surfaces to the other one of the two narrow side surfaces along a direction that is perpendicular to the longitudinal direction.
 3. The probe card device according to claim 1, wherein when the first guide unit and the second guide unit are staggered in the oblique direction, two of the inflection points respectively belonging to any two of the neck-like probes and facing the same side are each spaced apart from the first guide unit by a distance, and the distances defined by the two of the inflection points have a difference that is less than or equal to 1% of the probe length.
 4. The probe card device according to claim 1, wherein in each of the neck-like probes, the part of the ring-shaped insulator on any one of the two broad side surfaces has a filled portion arranged in the corresponding long slot and two end portions that are respectively connected to two opposite sides of the filled portion and that protrude from the corresponding long slot, and the two end portions are configured to be boundaries defining the thickness.
 5. The probe card device according to claim 1, wherein in each of the neck-like probes, a length of any one of the two long slots along the longitudinal direction is at least 50% of a length of the stroke segment along the longitudinal direction.
 6. The probe card device according to claim 1, wherein in each of the neck-like probes, the conductive pin is in a straight shape, and the stroke segment does not have any protrusion formed on the two broad side surfaces and the two narrow side surfaces.
 7. The probe card device according to claim 6, wherein the first guide unit includes a plurality of first guide boards, and the second guide unit includes a plurality of second guide boards, and wherein in each of the neck-like probes, one of the two end segments is fixed by staggeredly arranging the first guide boards, and the other one of the two end segments is fixed by staggeredly arranging the second guide boards.
 8. A neck-like probe of a probe card device, comprising: a conductive pin including: a stroke segment having two broad side surfaces and two narrow side surfaces, wherein each of the two broad side surfaces of the stroke segment has a long slot extending from one of the two narrow side surfaces to the other one of the two narrow side surfaces, and wherein the two long slots are arranged adjacent to each other and have a minimum distance therebetween that is 75%-95% of a maximum distance between the two broad side surfaces; and two end segments respectively extending from two ends of the stroke segment; and a ring-shaped insulator surrounding a portion of the stroke segment having the two long slots, wherein a portion of the neck-like probe corresponding in position to a part of the ring-shaped insulator on the two broad side surfaces has a thickness that is 85%-115% of the maximum distance, wherein when the two end segments of the neck-like probe are acted upon by a force so as to bend the stroke segment, the two broad side surfaces respectively have two inflection points that are respectively located in the two long slots thereof. 